Feb 19, 2020

Fabrication of a Grooved Single‐Crystal Silicon X‐Ray Analyzer

Silicon x‐ray analyzer crystals were microfabricated by dicing and etching 10.3 cm (4‐inch) diam, 1.35 mm thick, undoped float zone (111) silicon wafers. These analyzer crystals are intended for a beam line at the Advanced Photon Source synchrotron accelerator ring under construction at the Argonne National Laboratory. Parallel and perpendicular, 1 mm spaced grooves were cut on the silicon wafers using an automated dicing saw. The grooves were cut at 15° and 105° to the '110' primary flat to avoid crystallographic cleavage directions because mechanical strength was desired. The depth of the grooves was 1.15 mm, which was 85% of the wafer thickness. The two cutting parameters, progressive cutting thickness, and feed rate were optimized to reduce saw damage and chipping. Saw damage, which extended over a region of about 30 μm from grooves was removed by isotropic etching. The quality of the single crystal was tested by measuring the width of x‐ray rocking curves with a double‐crystal diffractometer. The best width obtained with 11.2 arc‐s. Since the ideal full width at half maximum (FWHM) according to x‐ray dynamical diffraction theory is 9.7 arc‐s, a broadening function with a FWHM of only 5.6 arc‐s is present due to residual strains (quadrature addition is assumed).


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