Sequential steps of material removal, which included polishing followed by KOH etching, were used to track threading dislocations along the growth direction. It was found that a threading dislocation can produce etch pits of different sizes at different depths in the wafer.
Mobility of the front of threading dislocations during growth was assessed by measuring change in the position of the dislocation etch pits upon sequential material removal. Statistical distribution of such displacements in the wafer plane was found to be lognormal. On average, the growth distance of 8 μm corresponded to the change in the etch pit position of about 2 μm. This shows that the front of threading dislocations has significant mobility during SiC sublimation growth, resulting in tilted or curved dislocation lines in the grown crystal.
Source:Journal of Crystal Growth
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